By Andrea Chen,Randy Hsiao-Yu Lo
In semiconductor production, knowing how a number of fabrics behave and engage is important to creating a competent and powerful semiconductor package deal. Semiconductor Packaging: fabrics interplay and Reliability presents a basic figuring out of the underlying actual homes of the fabrics utilized in a semiconductor package deal.
The booklet specializes in a big step in semiconductor manufacturing—package meeting and trying out. It covers the fundamentals of fabric houses and explains the way to be certain which behaviors are vital to package deal functionality. The authors additionally talk about how the homes of packaging fabrics have interaction with each one one other and discover tips to maximize the functionality of those fabrics in regard to package deal integrity and reliability.
By tying jointly the disparate parts necessary to a semiconductor package deal, this easy-to-read booklet exhibits how all of the elements healthy and interact to supply sturdy defense for the built-in circuit chip inside in addition to a method for the chip to speak with the surface world.
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Semiconductor Packaging: Materials Interaction and Reliability by Andrea Chen,Randy Hsiao-Yu Lo
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