By Rao Tummala
LEARN approximately MICROSYSTEMS PACKAGING FROM the floor UP
Written via Rao Tummala, the field’s prime writer, basics of Microsystems Packaging is the one ebook to hide the sphere from wafer to structures, together with each significant contributing expertise. This rigorous and thorough creation to digital packaging applied sciences offers a pretty good grounding in microelectronics, photonics, RF, packaging layout, meeting, reliability, checking out, and production and its relevance to either semiconductors and platforms. You’ll find:
*Full assurance of electric, mechanical, chemical, and fabrics points of every technology
*Easy-to-read schematics and block diagrams
*Fundamental methods to all process issues
*Examples of all universal configurations and technologies—wafer point packaging, unmarried chip, multichip, RF, opto-electronic, microvia forums, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and production processes
*Basics of electric and reliability testing
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Fundamentals of Microsystems Packaging (EPI) by Rao Tummala
by George
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